LBM2016T1R0J [TAIYO YUDEN]
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE);
| 型号： | LBM2016T1R0J |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE) |
| 文件： | 总12页 (文件大小：627K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Notice for TAIYO YUDEN productsꢀ
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2013. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that TAIYO YUDEN CO., LTD. shall not be responsible for any defects in products or equipment incor-
porating such products, which are caused under the conditions other than those specified in this catalog or indi-
vidual specification.
■ Please contact TAIYO YUDEN CO., LTD. for further details of product specifications as the individual specification
is available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact TAIYO YUDEN CO., LTD. for more detail in ad-
vance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called“TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that TAIYO YUDEN CO., LTD. shall have no responsibility for any controversies or disputes that may
occur in connection with a third party's intellectual property rights and other related rights arising from your usage
of products in this catalog. TAIYO YUDEN CO., LTD. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign Exchange and For-
eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
REFLOW
■PARTS NUMBER
*Operating Temp. : -40～+105℃（Including self-generated heat）
△＝Blank space
L
B
M
2
0
1
6
T
1
0
0
J
△
⑥
①
②
③
④
⑤
①Series name
Code
④Nominal inductance
Series name
Code
Nominal inductance［μH］
（example）
LBM
Wound chip inductor for signal line
R12
0.12
1.00
10
②Dimensions（L×W）
1R0
Code
2016
Dimensions（L×W）［mm］
2.0×1.6
100
101
100
※R＝Decimal point
③Packaging
⑤Inductance tolerance
Code
T
Packaging
Taping
Code
J
Inductance tolerance
±5％
／
⑥Internal code
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
Surface Mounting
・Mounting and soldering conditions should be checked beforehand.
・Applicable soldering process to these products is reflow soldering only.
Type
A
B
C
1.8
LBM2016
0.6
1.0
Unit：mm
Standard quantity [pcs]
Type
L
W
T
e
Paper tape
Embossed tape
2.0±0.2
1.6±0.2
1.6±0.2
0.5±0.2
（0.02±0.008）
LBM2016
－
2000
（0.08±0.008）
（0.063±0.008）
（0.063±0.008）
Unit：mm（inch）
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
65
■PARTS NUMBER
●LBM2016 type
Parts number
Self-resonant
frequency
［MHｚ］（min.）
Measuring
frequency
［MHz］
Nominal inductance
［μH］
Q
（min.）
DC Resistance
［Ω］（±30％）
Rated current
［mA］（max.）
EHS
Inductance tolerance
LBM 2016TR12J
LBM 2016TR15J
LBM 2016TR18J
LBM 2016TR22J
LBM 2016TR27J
LBM 2016TR33J
LBM 2016TR39J
LBM 2016TR47J
LBM 2016TR56J
LBM 2016TR68J
LBM 2016TR82J
LBM 2016T1R0J
LBM 2016T1R2J
LBM 2016T1R5J
LBM 2016T1R8J
LBM 2016T2R2J
LBM 2016T2R7J
LBM 2016T3R3J
LBM 2016T3R9J
LBM 2016T4R7J
LBM 2016T5R6J
LBM 2016T6R8J
LBM 2016T8R2J
LBM 2016T100J
LBM 2016T120J
LBM 2016T150J
LBM 2016T180J
LBM 2016T220J
LBM 2016T270J
LBM 2016T330J
LBM 2016T390J
LBM 2016T470J
LBM 2016T560J
LBM 2016T680J
LBM 2016T820J
LBM 2016T101J
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
25
25
25
25
25
25
25
25
25
25
20
20
20
20
20
15
600
550
500
450
425
400
375
350
300
270
250
220
180
135
100
75
0.13
0.15
0.15
0.20
0.21
0.21
0.26
0.26
0.29
0.32
0.34
0.38
0.41
0.47
0.48
0.54
0.59
0.68
0.74
0.78
0.88
0.97
1.1
610
570
560
520
510
490
440
430
410
400
390
385
370
350
345
340
310
290
275
270
255
240
225
215
200
190
150
140
130
125
120
115
95
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
0.796
55
48
43
40
36
33
30
／
27
1.2
12
23
1.4
15
20
1.5
18
18
2.5
22
17
2.8
27
16
3.2
33
15
3.6
39
14
3.9
47
13
4.1
56
12
5.9
68
11
7.0
90
82
10
7.7
85
100
9.0
8.0
80
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
66
WIRE-WOUND CHIP INDUCTORS (LB SERIES)，
WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES)，
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■PACKAGING
①Minimum Quantity
Standard Quantity ［pcs］
Type
Paper Tape
Embossed Tape
LB C3225
CB C3225
LB 3218
LB R2518
LB C2518
LB 2518
CB 2518
CB C2518
LBM2016
LB C2016
LB 2016
CB 2016
CB C2016
LB 2012
LB C2012
LB R2012
CB 2012
CB C2012
CB L2012
LB 1608
LBMF1608
CBMF1608
－
－
1000
2000
－
－
－
2000
2000
3000
4000
4000
－
－
－
3000
②Tape material
●Embossed tape
Top tape
Chip Filled
Sprocket hole
Chip cavity
Base tape
Chip
●Card board carrier tape
Top tape
Base tape
Chip Filled
Sprocket hole
Chip cavity
Bottom tape
Chip
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_pack_e-E02R01
③Taping Dimensions
●Embossed Tape （0.315 inches wide）
Chip cavity
Insertion pitch
F
Tape thickness
Type
A
1.75±0.1
B
T
K
2.1±0.1
4.0±0.1
0.3±0.05
1.9max.
LBM2016
（0.069±0.004）
2.8±0.1
（0.083±0.004）
3.5±0.1
（0.157±0.004）
4.0±0.1
（0.012±0.002）
0.3±0.05
（0.075max.）
4.0max.
LB C3225
CB C3225
（0.110±0.004）
2.1±0.1
（0.138±0.004）
3.5±0.1
（0.157±0.004）
4.0±0.1
（0.012±0.002）
0.3±0.05
（0.157max.）
2.2max.
LB 3218
（0.083±0.004）
（0.138±0.004）
（0.157±0.004）
（0.012±0.002）
（0.087max.）
LB 2518
CB 2518
LB C2518
CB C2518
LB R2518
LB 2016
CB 2016
LB C2016
CB C2016
LB 2012
CB 2012
LB C2012
CB C2012
LB R2012
LBMF1608
CBMF1608
2.15±0.1
2.7±0.1
4.0±0.1
0.3±0.05
2.2max.
（0.085±0.004）
（0.106±0.004）
（0.157±0.004）
（0.012±0.002）
（0.087max.）
1.75±0.1
2.1±0.1
4.0±0.1
0.3±0.05
1.9max.
（0.069±0.004）
（0.083±0.004）
（0.157±0.004）
（0.012±0.002）
（0.075max.）
1.45±0.1
2.25±0.1
4.0±0.1
0.25±0.05
1.45max.
（0.057±0.004）
（0.089±0.004）
（0.157±0.004）
（0.010±0.002）
（0.057max.）
1.1±0.1
1.9±0.1
4.0±0.1
0.25±0.05
1.2max.
（0.043±0.004）
（0.075±0.004）
（0.157±0.004）
（0.010±0.002）
（0.047max.）
Unit：mm（inch）
●Card board carrier tape（0.315 inches wide）
Chip cavity
Insertion pitch
F
Tape thickness
T
Type
A
B
1.55±0.1
CB L2012
2.3±0.1
4.0±0.1
1.1max.
（0.061±0.004）
（0.091±0.004）
1.8±0.1
（0.071±0.004）
（0.157±0.004）
4.0±0.1
（0.157±0.004）
（0.043max.）
1.1max.
1.0±0.1
LB 1608
（0.039±0.004）
（0.043max.）
Unit：mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_pack_e-E02R01
④Leader and Blank Portion
⑤Reel Size
⑥Top Tape Strength
The top tape requires a peel-off force 0.2 to 0.7N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_pack_e-E02R01
WIRE-WOUND CHIP INDUCTORS (LB SERIES),
WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES),
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■RELIABILITY DATA
1.Operating temperature Range
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
LBM Series
Specified Value
－40～＋105℃（Including self-generated heat）
2. Storage Temperature Range（after soldering）
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
LBM Series
－40～＋85℃
Test Methods and LB, CB Series：
Remarks
Please refer the term of "7. storage conditions" in precautions.
3.Rated Current
Specified Value
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
LBM Series
Within the specified tolerance
4.Inductance
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
LBM Series
Specified Value
Within the specified tolerance
Test Methods and LB・LBC・LBR・CB・CBC・CBL・LBMF・CBMF・LBM Series
Remarks
Measuring equipment
：LCR Mater（HP4285A or its equivalent）
5.Q
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
LBM Series
－
Specified Value
Within the specified tolerance
Test Methods and LBM Series
Remarks
Measuring equipment
: LCR Mater（HP4285A or its equivalent）
6.DC Resisitance
Specified Value
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
LBM Series
Within the specified tolerance
Test Methods and
Remarks
Measuring equipment : DC Ohmmeter （HIOKI 3227 or its equivalent）
7.Self-Resonant Frequency
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
LBM Series
Within the specified tolerance
Test Methods and
Remarks
Measuring equipment : Impedance analyzer （HP4291A or its equivalent）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-E02R01
8.Temperature Characteristic
LBM2016
Inductance change : Within±5％
Inductance change : Within±20％
LB1608
LB2012
LBR2012
CB2016
LBC3225
LBC2016
LB3218
CB2012
LB2518
CBL2012
LB2016
Specified Value
LBR2518
LBMF1608
LBC2518
LBC2012
CB2518
CBC3225
CBC2016
CBMF1608
CBC2518
CBC2012
Inductance change : Within±25％
Inductance change : Within±35％
Change of maximum inductance deviation in step 1-5
Temperature（℃）
Step
LB, CB Series
1
2
3
4
5
20
Test Methods and
Remarks
－40
20（Reference temperature）
＋85（Maximum operating temperature）
20
9.Rasistance to Flexure of Substrate
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
LBM Series
No damage.
Warp
: 2mm（LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF Series）
Test substrate : Board according to JIS C0051
Thickness
: 0.8mm（LB・LBMF・CBMF1608）
: 1.0ｍｍ（Others）
Test Methods and
Remarks
10.Body Strength
Specified Value
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
LBM Series
No damage.
LB・LBC・LBR・CB・CBC・CBL・LBM
Applied force : 10N
Test Methods and
Remarks
Duration
: 10sec.
LB1608・LBMF1608・CBMF1608
Applied force : 5N
Duration
: 10sec.
11.Adhesion of terminal electrode
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
LBM Series
Specified Value
No abnormality.
LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF
Applied force
Duration
: 10N to X and Y directions
: 5 sec.
Test Methods and
Remarks
Test substrate
: Printed board
LB1608・CBMF1608・LBMF1608
Applied force
Duration
Test substrate
: 5N to X and Y directions
: 5 sec.
: Printed board
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-E02R01
12.Resistance to vibration
LB, LBC, LBR, LBMF Series
Inductance change : Within±10％
No significant abnormality in appearance.
CB, CBC, CBL, CBMF Series
LBM Series
Specified Value
Inductance change : Within±5％
No significant abnormality in appearance.
LB・LBR・LBC・CB・CBC・CBL・LBM・LBMF・CBMF : According to JIS C5102 clause 8.2.
Vibration type
Directions
: A
: 2 hrs each in X, Y and Z directions. Total：6 hrs
: 10 to 55 to 10 Hz（1min.）
Test Methods and
Remarks
Frequency range
Amplitude
: 1.5mm
Mounting method
Recovery
: Soldering onto printed board
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48
hrs.
13.Drop test
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
LBM Series
Specified Value
－
14.Solderability
Specified Value
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
LBM Series
At least 90％ of surface of terminal electrode is covered by new
LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF：
Test Methods and
Remarks
Solder temperature
Duration
: 245±5℃
: 5±0.5sec
Flux
: Methanol solution with 25％ of colophony
15.Resistance to soldering
LB, LBC, LBR, LBMF Series
Inductance change : Within±10％
Inductance change : Within±5％
Specified Value
CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF：
Remarks 3 times of reflow oven at 230℃ MIN for 40sec. with peak temperature at 260 ℃ for 5sec.
16.Resisitance to solvent
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
LBM Series
－
Solvent temperature
Type of solvent
: Room temperature
Test Methods and
Remarks
: Isopropyl alcohol
Cleaning conditions
: 90s. Immersion and cleaning.
17.Thermal shock
Specified Value
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
LBM Series
Inductance change : Within±10％
No significant abnormality in appearance.
Test Methods and LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF：－40～＋85℃, maintain times 30min. ,100 cycle
Remarks Recovery : At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-E02R01
18.Damp heat life test
Specified Value
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
LBM Series
Inductance change : Within±10％
No significant abnormality in appearance.
Temperature
Test Methods and Humidity
: 60±2℃
: 90～95％RH
: 1000 hrs
Remarks
Duration
Recovery
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
19.Loading under damp heat life test
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and Temperature
Inductance change : Within±10％
No significant abnormality in appearance.
Specified Value
: 60±2℃
Remarks
Humidity
: 90～95％RH
: 1000 hrs
Duration
Applied current
Recovery
: Rated current
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
20.High temperature life test
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
－
Specified Value
Inductance change : Within±10％
LBM Series
No significant abnormality in appearance.
Temperature
Duration
: 85±2℃
: 1000 hrs
Test Methods and
Remarks
Recovery
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
21.Loading at high temperature life test
Specified Value
Inductance change : Within±10％
LB, LBC, LBR, LBMF Series
（LBC3225 Series : Within±20％）
No significant abnormality in appearance.
CB, CBC, CBL, CBMF Series
－
LBM Series
Temperature
: 85±2℃
Test Methods and Duration
: 1000 hrs
Remarks
Applied current
Recovery
: Rated current
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
22.Low temperature life test
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
Inductance change : Within±10％
Specified Value
No significant abnormality in appearance.
LBM Series
Temperature
Duration
: －40±2℃
: 1000 hrs
Test Methods and
Remarks
Recovery
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
23.Standard condition
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
Standard test conditions
Unless specified, Ambient temperature is 20±15℃ and the Relative
humidity is 65±20％. If there is any doubt about the test results, further
measurement shall be had within the following limits:
Ambient Temperature: 20±2℃
Specified Value
LBM Series
Relative humidity: 65±5％
Inductance value is based on our standard measurement systems.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-E02R01
WIRE-WOUND CHIP INDUCTORS (LB SERIES)，
WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES)，
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■PRECAUTIONS
1．Circuit Design
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment, (office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
Precautions
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2．PCB Design
◆Land pattern design
Precautions
1. Please contact any of our offices for a land pattern, and refer to a recommended land pattern of a right figure or specifications.
PRECAUTIONS
【Recommended Land Patterns】
Technical
Surface Mounting
considerations
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to those products is reflow soldering only.
3．Considerations for automatic placement
◆Adjustment of mounting machine
Precautions
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
Technical
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
considerations
4．Soldering
Precautions
◆Reflow soldering（ LB and CB Types）
1. For reflow soldering with either leaded or lead-free solder, the profile specified in "point for controlling" is recommended.
◆Recommended conditions for using a soldering iron
1. Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350℃ Duration-3 seconds or less. The soldering iron
should not come in contact with inductor directly.
◆Reflow soldering（ LB and CB Types）
1. Reflow profile
Technical
considerations
◆Recommended conditions for using a soldering iron
1. Components can be damaged by excessive heat where soldering conditions exceed the specified range.
5．Cleaning
Precautions
◆Cleaning conditions
Washing by supersonic waves shall be avoided.
Technical
◆Cleaning conditions
considerations
If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_prec_e-E02R01
6．Handling
Precautions
◆Handling
1. Keep the inductors away from all magnets and magnetic objects.
◆Breakaway PC boards（ splitting along perforations）
1. When splitting the PC board after mounting inductors, care should be taken not to give any stresses of deflection or twisting to the
board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the inductors any excessive mechanical shocks.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards（ splitting along perforations）
1. Planning pattern configurations and the position of products should be carefully performed to minimize stress.
◆Mechanical considerations
Technical
considerations
1. There is a case to be damaged by a mechanical shock.
7．Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Precautions
Ambient temperature：0～40℃ / Humidity：Below 70% RH
The ambient temperature must be kept below 30℃ even under ideal storage conditions, solderability of products electrodes may
decrease as time passes. For this reason,
LB type：Should be used within 6 months from the time of delivery.
◆Storage
Technical
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
considerations
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_prec_e-E02R01
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